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Manufacturing and Technology |
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| Process Capability |
2014 |
2015 |
| Layer |
14 |
16 |
| Max. Board Size (mm) |
1050*600 |
1100*600 |
| Max. Board Thickness |
5mm |
6mm |
| Max. Copper Weight |
I/L: 4OZ |
I/L: 5OZ |
| O/L: 5OZ |
O/L: 5OZ |
| Min. Trace/Space |
0.075/0.075mm |
0.075/0.075mm |
| Min. Hole Size |
0.15mm |
0.15mm/0.1mm（HDI） |
| Aspect Ratio |
10:01 |
12:01 |
| Impedance Control |
±10% |
±8% |
| S/M Plugging |
MP |
MP |
| Resin Plugging |
MP |
MP |
| POFV |
Samples |
MP |
| Laser Drilling |
N |
Samples |
| S/M Color |
Green, White, Black, Blue, Yellow, Red |
Green, White, Black, Blue, Yellow, Red |
| Peelable Mask |
Y |
Y |
| Carbon Ink |
Y |
Y |
| Legend Color |
Black, White, Yellow |
Black, White, Yellow |
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